1. 2. 3. material content data sheet sales product name tle4966-3k issued 28. august 2013 ma# MA000866708 package pg-tsop6-6-5 weight* 13.46 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.856 6.36 6.36 63596 63596 leadframe inorganic material silicon 7440-21-3 0.001 0.01 81 non noble metal titanium 7440-32-6 0.005 0.04 404 non noble metal chromium 7440-47-3 0.016 0.12 1211 non noble metal copper 7440-50-8 5.414 40.21 40.38 402079 403775 wire noble metal gold 7440-57-5 0.021 0.15 0.15 1543 1543 encapsulation organic material carbon black 1333-86-4 0.050 0.37 3734 plastics brominated resin - 0.063 0.47 4667 inorganic material antimonytrioxide 1309-64-4 0.126 0.93 9335 plastics epoxy resin - 1.144 8.49 84946 inorganic material silicondioxide 60676-86-0 4.902 36.41 46.67 364056 466738 leadfinish non noble metal tin 7440-31-5 0.299 2.22 2.22 22200 22200 plating noble metal silver 7440-22-4 0.155 1.15 1.15 11479 11479 glue plastics epoxy resin - 0.072 0.54 5367 noble metal silver 7440-22-4 0.341 2.53 3.07 25302 30669 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
